Exciting news in the world of tech and finance! The Chinese mainland has unveiled its first batch of sci-tech innovation bonds, marking the launch of a new sci-tech board. This initiative aims to support cutting-edge innovation by connecting financial institutions, tech enterprises, and investment funds with flexible long-term financing options. 🚀
A dynamic roadshow held at the Beijing Financial Assets Exchange showcased bonds from eight pioneering firms entering the interbank market. Pan Gongsheng, governor of the People’s Bank of China, highlighted how these diverse financial tools are designed to meet the long cycle demands of scientific and technological advancements.
Technology leaders like Duan Dawei of iFLYTEK emphasize that flexible bond terms and longer maturities are key to cost-effective, enduring innovation. With nearly 100 market institutions preparing to issue over 300 billion yuan worth of sci-tech innovation bonds, the future of tech financing looks promising and robust.
Stay tuned for more updates as this bold financial model continues to empower tech innovation and shape a rapidly evolving landscape. 🌟
Reference(s):
cgtn.com
